Title:
半導体装置及びその材料
Document Type and Number:
Japanese Patent JP4666703
Kind Code:
B2
Inventors:
Keiko Hata
Matsuoka Yoshio
Matsuoka Yoshio
Application Number:
JP29001599A
Publication Date:
April 06, 2011
Filing Date:
October 12, 1999
Export Citation:
Assignee:
Asahi Kasei E-materials Co., Ltd.
International Classes:
H01L21/768; C09D179/08; C09J179/08; H01L21/283; H01L21/312; H01L23/29; H01L23/31; H01L23/522
Domestic Patent References:
| JP5295115A | ||||
| JP7221259A | ||||
| JP11220069A | ||||
| JP2001024021A |
Foreign References:
| WO1998025297A1 |
Attorney, Agent or Firm:
Yoshio Narui
Hideo Takei
Yoshiaki Matsui
Hideo Takei
Yoshiaki Matsui