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Patent Searching and Data


Title:
SEMICONDUCTOR ELEMENT MODULE
Document Type and Number:
Japanese Patent JPH06300943
Kind Code:
A
Abstract:

PURPOSE: To provide a semiconductor module for optical communication featuring high reliability, low cost and high performance.

CONSTITUTION: This semiconductor module is formed with a fitting part 11 to be fitted with a ferrule for positioning an optical fiber from one opening end toward the inside and is formed with an element housing part 13 coaxial with the fitting part 11 from the other opening end toward the inside. The semiconductor element module includes a sleeve 1 which is internally formed with a lens holding part 12 by passing the sleeve through the fitting part 11 and the element housing part 13, a stem 31 which is fixed to the sleeve 1 at the other opening end, a semiconductor light emitting element or light receiving element which is fixed to the surface of the stem 31 on the element housing part 13 side and a condenser lens 20 which is housed in the element housing part 13, is fixed to the sleeve 1 and optically couples the end face of the optical fiber to the light emitting end face of the semiconductor light emitting element or the light receiving end face of the semiconductor light receiving element. The material constituting the sleeve 1 consists of metal having the coefft. of thermal expansion approximate to the coefft. of thermal expansion of the material constituting the condenser lens 20.


Inventors:
KARAUCHI ICHIROU
AKITA OSAMU
Application Number:
JP9005993A
Publication Date:
October 28, 1994
Filing Date:
April 16, 1993
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
G02B6/32; G02B6/42; G02B7/02; G02B6/00; H01S5/022; (IPC1-7): G02B6/42; G02B6/00; G02B6/32
Attorney, Agent or Firm:
Yoshiki Hasegawa (3 outside)