Title:
半導体素子及び半導体素子の製造方法
Document Type and Number:
Japanese Patent JPWO2005086216
Kind Code:
A
Inventors:
Kawamoto 洋
Application Number:
JP2005004124W
Publication Date:
September 15, 2005
Filing Date:
March 09, 2005
Export Citation:
Assignee:
Independent administrative institution Japan Science and Technology Agency
International Classes:
H01L25/065; H01L21/60; H01L23/52; H01L21/3205; H01L25/18; H01L25/07
Attorney, Agent or Firm:
Yasuo Hirai
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