Title:
半導体装置
Document Type and Number:
Japanese Patent JP7098953
Kind Code:
B2
Abstract:
A semiconductor apparatus includes: an insulating substrate including an insulating layer having first and second main surfaces, a metal plate on the first main surface, and first to fourth conductors on the second main surface; a semiconductor device including a rear electrode electrically connected to the first conductor and a front electrode electrically connected to the second conductor; a temperature detection device including a first electrode electrically connected to the third conductor and a second electrode electrically connected to the fourth conductor; a first terminal electrically connected to the third conductor; a second terminal positioned so as to be wire-connectable to the fourth conductor; and a third terminal electrically connected to the second conductor, wherein the fourth conductor is positioned so as to be wire-connectable to the second conductor.
Inventors:
Koichi Masuda
Application Number:
JP2018027780A
Publication Date:
July 12, 2022
Filing Date:
February 20, 2018
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/58; H01L25/07; H01L25/18
Domestic Patent References:
| JP2002076236A | ||||
| JP2011086821A |
Foreign References:
| WO2015083250A1 |
Attorney, Agent or Firm:
Yasutaka Kuratani
Matsui Shigeaki
Kenro Date
Matsui Shigeaki
Kenro Date