Title:
半導体製造装置
Document Type and Number:
Japanese Patent JP2528708
Kind Code:
B2
Abstract:
In a semiconductor double-chamber etching apparatus, this etching apparatus can be manually operated in a maintenance area by connecting the movable manual operation panel, with a communication means, to anyone of a plurality of relay stations provided to the etching apparatus installed facing to the maintenance area, without using the manual operation panel of the etching apparatus provided to a face of the etching apparatus facing to the clean room adjacent to the maintenance area, being separated by a partition wall.
Inventors:
藤村 修三
Application Number:
JP6125289A
Publication Date:
August 28, 1996
Filing Date:
March 14, 1989
Export Citation:
Assignee:
富士通株式会社
International Classes:
G03F7/20; H01L21/00; H01L21/302; H01L21/02; H01L21/30; H01L21/3065; (IPC1-7): H01L21/02; H01L21/3065
Domestic Patent References:
| JPS6345605A | ||||
| JP64050198A | ||||
| JPS62285200A | ||||
| JP59100302B | ||||
| JPH0268923A | ||||
| JPS6357734B2 | ||||
| JPS62299024A |
Attorney, Agent or Firm:
福島 康文