To make a substrate or a module compact.

A semiconductor incorporated substrate comprises: a semiconductor component having a through electrode; and a substrate having electrodes provided on a top surface and backside of the semiconductor component and connected to the through electrode. Alternatively, a semiconductor integrated substrate comprises: semiconductor components having through electrodes and stacked in layers to have at least portions of the through electrodes electrically connected to each other; and a substrate having electrodes provided on the top surface of the top stage and the backside of the bottom stage of the semiconductor components stacked in the layers and connected to the through electrodes.