PURPOSE: To enable the stable feed and the cut of wire by a method wherein a front clamper is provided in front of a tool to cut a wire.
CONSTITUTION: A tool 1 is fitted to an ultrasonic horn 6, and a wire 2 is inserted into the tool 1. A clamper 3 carries out an opening action through an open-close drive 4 and a closing action by a tension spring 5 to hold the wire 2. Moreover, the clamper 3 makes a longitudinal movement to deliver the wire 2. A front clamper 10 located in front of the tool 1 moves up or down through a up-down slide 8 and makes an opening action through an open-close drive 4 and a closing action by a tension spring 5. After the wire 2 is bonded to a pellet 9 through supersonic, and the front clamper 10 is made to ascend further to cut the wire 2.
JP3324144 | ELECTRODE BONDER |
JPH0582597 | SEMICONDUCTOR DEVICE |
JP2830109 | INDUSTRIAL APPLICABILITY: Bump forming method and bump forming apparatus |