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Patent Searching and Data


Title:
SEMICONDUCTOR INNER CONNECTION DEVICE
Document Type and Number:
Japanese Patent JPH02276260
Kind Code:
A
Abstract:

PURPOSE: To enable the stable feed and the cut of wire by a method wherein a front clamper is provided in front of a tool to cut a wire.

CONSTITUTION: A tool 1 is fitted to an ultrasonic horn 6, and a wire 2 is inserted into the tool 1. A clamper 3 carries out an opening action through an open-close drive 4 and a closing action by a tension spring 5 to hold the wire 2. Moreover, the clamper 3 makes a longitudinal movement to deliver the wire 2. A front clamper 10 located in front of the tool 1 moves up or down through a up-down slide 8 and makes an opening action through an open-close drive 4 and a closing action by a tension spring 5. After the wire 2 is bonded to a pellet 9 through supersonic, and the front clamper 10 is made to ascend further to cut the wire 2.


Inventors:
KIMURA NAOTO
Application Number:
JP9800889A
Publication Date:
November 13, 1990
Filing Date:
April 17, 1989
Export Citation:
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Assignee:
KYUSHU NIPPON ELECTRIC
International Classes:
H01L21/607; H01L21/60; (IPC1-7): H01L21/607
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)