PURPOSE: To surely enable the execution of defect marking without adding marking means, by individually moving a wafer mounting stand in accordance with the size of a semiconductor element only when a semiconductor element judged as an imperfect element is present among elements subjected to simultaneous inspection, and executing marking with a marking means installed along the relative moving direction.

CONSTITUTION: Simultaneous inspection for four semiconductor elements 1 is executed by using four probe heads 5. When no imperfect elements exist in one block subjected to the simultaneous inspection, a wafer mounting stand 3 is moved in accordance with the four chip sizes. Only when an imperfect element is present, the wafer mounting stand 3 is moved in accordance with one chip size. By arranging each inner 6 with respect to the moving direction of the wafer mounting stand 3, marking is enabled for all elements. As a result, the number of inkers can be reduced to a minimum, and the increase of equipment dimension can be restrained even in the case where the number of elements for simultaneous inspection is increased.