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Title:
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JP2003100876
Kind Code:
A
Abstract:

To provide a semiconductor integrated circuit device which can easily respond to the change in the memory capacity of a memory device and by which signals/data can be transmitted at a high speed and with a low electric power consumption regardless of the change in the bus wiring length.

A semiconductor chip (CH) is divided into a first semiconductor region (2) surrounded by pads (1) and a region outside the pads (1). A memory (20) is placed in the region outside the pads (1). A memory (37) placed in the first semiconductor region (2) and the memory (20) placed outside the pads (1) are coupled to a bass interface unit (33) through respectively different memory busses (36 and 39) and a selector (100). The selector (100) is driven by two-phase clock signals (P1 and P2) of the same phase.


Inventors:
NAGATA SHINYA
WATANABE KATSUKICHI
IKEMOTO MASAHIKO
Application Number:
JP2001288792A
Publication Date:
April 04, 2003
Filing Date:
September 21, 2001
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G11C11/41; G11C5/02; G11C5/06; G11C7/10; G11C11/401; G11C11/408; G11C11/413; G11C11/417; G11C16/02; H01L21/82; H01L21/822; H01L27/04; (IPC1-7): H01L21/822; G11C11/401; G11C11/408; G11C11/41; G11C11/413; G11C11/417; G11C16/02; H01L21/82; H01L27/04
Attorney, Agent or Firm:
Hisami Fukami (4 outside)