Title:
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH0563138
Kind Code:
A
Abstract:
PURPOSE: To offer an LSI package for a device having semiconductor chips on a substrate in high density.
CONSTITUTION: An LSI package, in which a plurality of semiconductor chips 4 are laminated on a carrier substrate 2 by electrically connecting one side ends of leads 8 provided on an insulating film 7 with bumps provided on the bonding pads of the semiconductor chips 4 while the other ends of the leads 8 are arranged around through holes 9 provided on the insulating film 7 and the conductive pins 11 set up on a carrier substrate 2 are inserted through the through holes 9.
Inventors:
SHIMOISHI TOMOAKI
TOMITA HIROAKI
ICHIHARA SEIICHI
USUI TOSHIO
TOMITA HIROAKI
ICHIHARA SEIICHI
USUI TOSHIO
Application Number:
JP8646091A
Publication Date:
March 12, 1993
Filing Date:
April 18, 1991
Export Citation:
Assignee:
HITACHI LTD
HITACHI VLSI ENG
HITACHI MICOM SYST KK
HITACHI TOBU SEMICONDUCTOR LTD
HITACHI VLSI ENG
HITACHI MICOM SYST KK
HITACHI TOBU SEMICONDUCTOR LTD
International Classes:
H01L23/12; H01L25/065; H01L25/07; H01L25/10; H01L25/11; H01L25/18; (IPC1-7): H01L23/12; H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Yamato Tsutsui
Next Patent: ELECTROSPARK MACHINING DEVICE