Title:
半導体集積回路装置、信号処理装置、及びFM多重データ処理装置
Document Type and Number:
Japanese Patent JP4476704
Kind Code:
B2
Abstract:
A semiconductor integrated circuit device includes a semiconductor substrate; at least one integrated circuit block formed in the semiconductor substrate; a first electrode pad which receives a first clock, the first electrode pad being disposed on the semiconductor substrate; a wiring line which electrically connects the integrated circuit block and the first electrode pad, the wiring line being disposed on the semiconductor substrate; and a second electrode pad which receives a second clock having the same frequency as and opposite polarity from the first clock, the second electrode pad being disposed in a position adjacent to the first electrode pad on the semiconductor substrate and isolated from the integrated circuit block.
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Inventors:
Hiroaki Inoue
Application Number:
JP2004172251A
Publication Date:
June 09, 2010
Filing Date:
June 10, 2004
Export Citation:
Assignee:
oki Semiconductor Co., Ltd.
International Classes:
H01L21/822; G06F1/10; H01L27/04; H01L27/00; H04B1/10; H04B1/18; H04B15/02
Domestic Patent References:
| JP11328963A |
Attorney, Agent or Firm:
Minoru Maeda
Youichi Yamagata
Masahiko Shinohara
Youichi Yamagata
Masahiko Shinohara