Title:
半導体集積回路装置
Document Type and Number:
Japanese Patent JP4887044
Kind Code:
B2
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Inventors:
Kunihiko Nishiyama
Eiji Yamamoto
Eiji Yamamoto
Application Number:
JP2006004697A
Publication Date:
February 29, 2012
Filing Date:
January 12, 2006
Export Citation:
Assignee:
Renesas Electronics Corporation
NTT DoCoMo, Inc.
NTT DoCoMo, Inc.
International Classes:
G06F13/362
Domestic Patent References:
| JP5165541A | ||||
| JP2005352668A | ||||
| JP2005316866A | ||||
| JP2005284580A | ||||
| JP2004199187A | ||||
| JP2007532066A | ||||
| JP2132542A | ||||
| JP2000172661A | ||||
| JP2004326462A |
Foreign References:
| WO2005099108A1 |
Attorney, Agent or Firm:
Yamato Tsutsui