Title:
半導体集積回路及び発振回路
Document Type and Number:
Japanese Patent JP5129028
Kind Code:
B2
Inventors:
Shinichi Hirose
Application Number:
JP2008144319A
Publication Date:
January 23, 2013
Filing Date:
June 02, 2008
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H03B5/32; H01L21/822; H01L27/04; H03K3/354
Domestic Patent References:
| JP2004096711A | ||||
| JP2002246843A | ||||
| JP2008072553A | ||||
| JP58015305A | ||||
| JP2209004A | ||||
| JP10242751A | ||||
| JP2118312U |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita