Title:
半導体集積回路及び発振回路
Document Type and Number:
Japanese Patent JP5407778
Kind Code:
B2
Inventors:
Hidehiko Yajima
Application Number:
JP2009258619A
Publication Date:
February 05, 2014
Filing Date:
November 12, 2009
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H03B5/32; H01L21/822; H01L27/04
Domestic Patent References:
| JP2002158288A | ||||
| JP2001257536A | ||||
| JP6276018A | ||||
| JP5048003A | ||||
| JP5070015U | ||||
| JP2001257534A | ||||
| JP5025742U |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka
Osamu Suzawa
Kazuhiko Miyasaka