Title:
半導体集積回路
Document Type and Number:
Japanese Patent JP6613837
Kind Code:
B2
Inventors:
Kenji Nakagomi
Application Number:
JP2015223228A
Publication Date:
December 04, 2019
Filing Date:
November 13, 2015
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H03K4/50
Domestic Patent References:
| JP2004080794A | ||||
| JP7266558A | ||||
| JP2008067005A | ||||
| JP2013187716A | ||||
| JP11074761A | ||||
| JP2000091890A | ||||
| JP9121142A | ||||
| JP62299109A | ||||
| JP2003319638A | ||||
| JP201338744A | ||||
| JP2001268944A |
Attorney, Agent or Firm:
Yoshiyuki Osuga
Hiroyoshi Aoki
Amada Masayuki
Hiroyoshi Aoki
Amada Masayuki