PURPOSE: To minimize inductance of a route from an input terminal to an input bonding pad and be free from limitation regarding an input signal containing a high frequency component by a method wherein bonding pads are located on a concentric circle on a semiconductor chip.

CONSTITUTION: An outer shape of a semiconductor chip 4 to be mounted on a package case 1 is made octagonal, bonding pads 5, 5... are located on a concentric circle, and the bonding pads 5, 5... are electrically connected to in-case leads 3, 3... of the package case 1. Therefore bonding pads 5 and leads 3 are connected by bonding wires 6 having the shortest and uniform length, realizing a route from each input terminal to a bonding pad 5 having uniform signal transmittance and at the same time minimizing inductance existing in the route.