Title:
半導体集積回路及びその製造方法
Document Type and Number:
Japanese Patent JP4198158
Kind Code:
B2
Inventors:
Shuichi Kikuchi
Tsutomu Fujino
Tsutomu Fujino
Application Number:
JP2006026371A
Publication Date:
December 17, 2008
Filing Date:
February 02, 2006
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L21/822; H01L21/8234; H01L21/8236; H01L21/8238; H01L27/04; H01L27/06; H01L27/088; H01L27/092
Domestic Patent References:
| JP6338589A | ||||
| JP4299856A | ||||
| JP5347386A | ||||
| JP3155659A | ||||
| JP62092459A |
Attorney, Agent or Firm:
Hiroshi Kakutani
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