PURPOSE: To improve positioning accuracy regardless of the resin for molding an LD (laser diode element) by a method wherein a bending section is formed on a lead frame in the direction parallel or vertical to the emitting direction of the laser light, and the bending section is used as a reference for the positioning.

CONSTITUTION: A part of the two sides of a lead frame 8 is bent so that it is parallel and symmetrical from an LD chip 1 to the direction of the emitted laser light viewed from the front. The LD consisting of a sub-mount 2, a chip 1, and a photo-diode is soldered on the main plane of a lead frame that is formed by the bent both sides and becomes a dented bottom of the lead frame 8. In this instance, the LD and the lead frame 8 are arranged so that their center line coincides with respect to the emitting direction of the laser, thereby improving the relative position between the LD chip 1 and the positioning section of the translucent resin 6 to be molded.