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Title:
SEMICONDUCTOR LASER MODULE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2000286498
Kind Code:
A
Abstract:

To obtain a semiconductor laser module which can easily obtain a high wavelength conversion efficiency and a method for manufacturing the module.

A semiconductor laser module 10 is formed by directly coupling a semiconductor laser 12, having a wavelength tuning mechanism with an optical wavelength conversion element 14 which emits a laser beam of second higher harmonics, by using the wavelength of an incident laser beam as a fundamental wave. The oscillation wavelength of the laser 12 is tunable and locked, so that the wavelength coincides with the phase matching wavelength of the wavelength conversion element 14. In the semiconductor laser 12, the substrates of the laser 12 and conversion element 14 are coupled directly with each other, at the end face of the optical waveguide 42 of the conversion element 14.


Inventors:
HATORI MASAMI
Application Number:
JP9384599A
Publication Date:
October 13, 2000
Filing Date:
March 31, 1999
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
H01S5/00; H01S5/022; H01S5/06; G02F1/35; H01S5/026; (IPC1-7): H01S5/022
Attorney, Agent or Firm:
Atsushi Nakajima (3 outside)