Title:
SEMICONDUCTOR LASER MODULE
Document Type and Number:
Japanese Patent JPH0497208
Kind Code:
A
Abstract:
PURPOSE:To obtain a highly reliabile semiconductor laser module stabilizing its optical output against a temperature change by providing an attenuation film between a semiconductor laser and an optical fiber for connecting an optical beam emitted from the laser. CONSTITUTION:A semiconductor package 10 mounting a semiconductor laser is fixed on a lens holder 11 at points A by YAG laser welding. A spherical lens 20 is fixed on a lens holder 21 with low melting point glass and an optical fiber terminal 30 formed on the leading part of an optical fiber 31 is fixed on a fiber support 32 at points D by YAG welding. The attenuation film 40 formed by evaporating metallic film consisting of NiCr on a glass base BK7 is stuck and fixed to the tip of the terminal 30. Thereby, an optical beam emitted from the semiconductor laser can be efficiently connected to the optical fiber 31. Consequently, output stability against a temperature change can be improved.
Inventors:
ISHIKAWA AKIRA
TAKAHASHI NOBUAKI
TAKAHASHI NOBUAKI
Application Number:
JP21196290A
Publication Date:
March 30, 1992
Filing Date:
August 10, 1990
Export Citation:
Assignee:
NIPPON ELECTRIC ENG
International Classes:
G02B6/42; H01L33/58; H01S5/00; (IPC1-7): G02B6/42; H01L33/00; H01S3/18
Attorney, Agent or Firm:
Uchihara Shin
Next Patent: JPS497209