To highly precisely position an emission point and a core by forming V grooves different in V groove width on a module main body and arranging an optical fiber in the V groove whose connection efficiency between the emission point of a semiconductor laser chip and the core of the optical fiber becomes largest.

The V grooves 7 are for arranging the optical fiber in any groove. The V groove widths 8 are formed in different size. The semiconductor laser chip is bonded on one of four solder areas formed on the module main body 1 by solder. The semiconductor laser chip is positioned on the module main body 1 with markers which are provided on the semiconductor substrate of the semiconductor laser chip and the upper face of the module main body 1 as references, for example. The optical fiber arranged in the V groove 7 and the emission point of the semiconductor laser chip are positioned and the optical fiber is bonded and fixed in the V groove 7.