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Patent Searching and Data


Title:
半導体レーザ及び半導体レーザの平坦化のためのプロセス
Document Type and Number:
Japanese Patent JP7436607
Kind Code:
B2
Abstract:
A laser structure may include a substrate, an active region arranged on the substrate, and a waveguide arranged on the active region. The waveguide may include a first surface and a second surface that join to form a first angle relative to the active region. A material may be deposited on the first surface and the second surface of the waveguide.

Inventors:
Dhow Ali Badar Alamine
Bowker Jason Daniel
green malcolm earl
Application Number:
JP2022177035A
Publication Date:
February 21, 2024
Filing Date:
November 04, 2022
Export Citation:
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Assignee:
Maycom Technology Solutions Holdings Incorporated
International Classes:
H01S5/223; H01S5/028
Domestic Patent References:
JP2016034013A
JP10093191A
JP7263751A
JP2005191380A
JP2005252229A
JP2012523718A
JP2004335530A
JP2011209629A
JP2003234528A
JP2002522909A
JP2006511942A
Foreign References:
CN101969179A
US7542497
US8787419
US4813052
US5291574
Attorney, Agent or Firm:
Shinichiro Tanaka
▲吉▼田 和彦
Ichiro Kurasawa
Yasushi Yamamoto