SEMICONDUCTOR LEAD FRAME GRASPING DEVICE

Title:

SEMICONDUCTOR LEAD FRAME GRASPING DEVICE

Document Type and Number:

Japanese Patent JPH06183566

Kind Code:

A

Abstract:

PURPOSE: To provide a semiconductor lead frame to reliable grasp semiconductor lead frames, contained in a contained cassette, one by one.

CONSTITUTION: A frame hand 1 is lowered on a semiconductor lead frame 8 in a top position and the slope 1b of the frame hand 1 is brought into contact with one end of the semiconductor lead frame 8. This operation causes lifting of the other end of the semiconductor lead frame 8. Then, air is blown through an air nozzle 9 to enter a gap between the upper and lower semiconductor lead frames so as to widen the gap therebetween. The operation causes lifting of the other end of the semiconductor lead frame 8 in a topmost position to a position where the other end thereof is brought into contact with the slope 1a of the frame hand 1. This constitution causes reliable grasping of only the topmost one of the laminated semiconductor lead frames.

Inventors:

KUDO NAOKI
MICHITSUJI YOSHIHISA
OZAWA NAOMITSU

Application Number:

JP35713792A

Publication Date:

July 05, 1994

Filing Date:

December 22, 1992

Export Citation:

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Assignee:

EBARA CORP

International Classes:

B65G59/02; B65G61/00; H01L21/50; (IPC1-7): B65G59/02; B65G61/00; H01L21/50

Attorney, Agent or Firm:

Takashi Kumagai (1 outside)

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