To provide a semiconductor light emitting device with protective element which can be manufactured simply.

The semiconductor light emitting device 10 with protective element comprises a substrate 12 having a surface on which leads 14a and 14b are formed. A composite chip 30 integrating an LED chip 16, a reflection film 18 and a ZD chip 20 is die bonded onto the substrate 12 (leads 14a and 14b). Subsequently, the p side electrode 16a of the LED chip 16 is connected electrically with the lead 14a through a bonding wire 24a and the n side electrode 16b is connected electrically with the lead 14b through a bonding wire 24b. The ZD chip 20 is bonded with a polarity reverse to that of the LED chip 16.