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Patent Searching and Data


Title:
SEMICONDUCTOR LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2005251875
Kind Code:
A
Abstract:

To provide a semiconductor light emitting device wherein light-deriving efficiency from a mold resin to an atmosphere is improved.

The semiconductor light emitting device is provided with a semiconductor light emitting element, the resin to package the semiconductor light emitting element, and a reflection prevention film that is formed on the surface of the resin and made of a a material having an intermediate refraction index between refractive indices of the resin and air. In addition, an irregular surface is formed on at least a part of the surface of the resin, and its average pitch is smaller than a half of the wavelength of light discharging through the resin.


Inventors:
SAKAI TAKAYUKI
Application Number:
JP2004058197A
Publication Date:
September 15, 2005
Filing Date:
March 02, 2004
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L23/29; H01L23/31; H01L29/22; H01L33/44; H01L33/54; H01L33/60; H01L33/62; (IPC1-7): H01L33/00; H01L23/29; H01L23/31
Domestic Patent References:
JP2000150965A2000-05-30
JP2005079244A2005-03-24
JP2003174191A2003-06-20
JPS6222491A1987-01-30
JPH0715034A1995-01-17
JPS6296902A1987-05-06
JP2002182003A2002-06-26
JP2001264520A2001-09-26
JP2001272505A2001-10-05
JP2001203392A2001-07-27
JP2002016287A2002-01-18
JPH06177432A1994-06-24
JPS5619686A1981-02-24
JP2001203393A2001-07-27
JPH11196220A1999-07-21
JP2004235337A2004-08-19
JPS6196780A1986-05-15
Attorney, Agent or Firm:
Masahiko Hinataji