Title:
SEMICONDUCTOR LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2005251875
Kind Code:
A
Abstract:
To provide a semiconductor light emitting device wherein light-deriving efficiency from a mold resin to an atmosphere is improved.
The semiconductor light emitting device is provided with a semiconductor light emitting element, the resin to package the semiconductor light emitting element, and a reflection prevention film that is formed on the surface of the resin and made of a a material having an intermediate refraction index between refractive indices of the resin and air. In addition, an irregular surface is formed on at least a part of the surface of the resin, and its average pitch is smaller than a half of the wavelength of light discharging through the resin.
Inventors:
SAKAI TAKAYUKI
Application Number:
JP2004058197A
Publication Date:
September 15, 2005
Filing Date:
March 02, 2004
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L23/29; H01L23/31; H01L29/22; H01L33/44; H01L33/54; H01L33/60; H01L33/62; (IPC1-7): H01L33/00; H01L23/29; H01L23/31
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Attorney, Agent or Firm:
Masahiko Hinataji