Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
半導体発光装置
Document Type and Number:
Japanese Patent JP4930162
Kind Code:
B2
Abstract:

To provide a semiconductor light emitting device capable of efficiently taking out emission light from a semiconductor light emitting element to the outside and improving light emission intensity.

The semiconductor light emitting device is provided with a light emitting element 14 for emitting the light emission output of strong directivity in a prescribed direction, a pedestal 11 for mounting the light emitting element, and a cap 15 disposed near the light emitting element on the pedestal. The cap comprises a cap main body 13 in a multilayer structure provided with an opening in the emitting direction of the light emission output of the light emitting element, and a light transmitting body 9 disposed so as to close the opening of the cap body in the state of being held between at least two layers of the cap main bodies, including a first cap main body 131 and a second cap main body 132 on the outside of the cap main bodies, and a gap part 12 is present at a position below the bottom surface of the light transmitting body between the two layers of the cap main bodies holding the light transmission body there between.

COPYRIGHT: (C)2009,JPO&INPIT


Inventors:
Takashi Sugiyama
Application Number:
JP2007099636A
Publication Date:
May 16, 2012
Filing Date:
April 05, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Nichia Corporation
International Classes:
H01S5/022; H01L33/50; H01L33/58
Domestic Patent References:
JP200520010A
JP2005283563A
JP2008153617A
JP10107323A
JP2004349567A
Attorney, Agent or Firm:
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto