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Title:
半導体発光素子
Document Type and Number:
Japanese Patent JP5038382
Kind Code:
B2
Abstract:
Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, and an active layer disposed therebetween, and a surface plasmon layer disposed between the active layer and at least one of the n-type and p-type semiconductor layers, including metallic particles and an insulating material, and including a conductive via for electrical connection between the active layer and the at least one of the n-type and p-type semiconductor layers, wherein the metallic particles are enclosed by the insulating material to be insulated from the at least one of the n-type and p-type semiconductor layers. The semiconductor light emitting device can achieve enhanced emission efficiency by using surface plasmon resonance. Using the semiconductor light emitting device, the diffusion of a metal employed for surface plasmon resonance into the active layer can be minimized.

Inventors:
Lee Dong Ritsu
Park
Sleep
Zhao Zhou
Zhao Chang
Gold heaven
Gradually rising
Chung Ming Nyu
Kim Dong Shun
Application Number:
JP2009275244A
Publication Date:
October 03, 2012
Filing Date:
December 03, 2009
Export Citation:
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Assignee:
Rensselaer Polytechnic Institute
International Classes:
H01L33/02
Domestic Patent References:
JP2007165284A
JP2003168823A
Other References:
Min-Ki Kwon et al.,Surface-Plasmon-Enhanced Light-Emitting Diodes,Advanced Materials,2008年 3月 7日,Vol.20,p1253-1257
Dong-Ming Yeh et al.,Surface plasmon coupling effect in an InGaN/GaN single-quantum-well light-emitting diode,Applied Physics Letters,2007年10月23日,Vol.91,p.171103
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito



 
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