Title:
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3730651
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a processing method of wafer which has an advantage of a sheet by sheet transfer system and that of a batch transfer system, in a semiconductor manufacturing apparatus such as a vertical CVD (chemical vapor deposition) diffusion apparatus.
SOLUTION: In this apparatus, a wafer is transferred between a cassette for housing the wafer and a boat for supporting the wafer at processing, and the wafer supported by the boat is processed in a reaction chamber. Further, the required number of wafer transferring plates are provided in a vertical direction above a turntable capable of rotating and moving up and down. The plate is provided while movable and retractable on the turntable. The wafers are transferred between the cassette and the boat by a wafer transfer machine in which the required number of supporting plates comprises an individual wafer transferring plate 38, transferring the wafer sheet by sheet in a time, and a plurality of plates transferring a plurality of wafers in a time together with the individual wafer transferring plates 39, 40, 41 and 42. At transferring the wafer, with the individual wafer transferring plate as a reference, pitches between the supporting plates are varied in the vertical direction for transfer.
Inventors:
Toshikazu Kano
Application Number:
JP2004240775A
Publication Date:
January 05, 2006
Filing Date:
August 20, 2004
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
B25J15/00; H01L21/677; B65G49/07; H01L21/68; (IPC1-7): H01L21/68; B25J15/00; B65G49/07
Domestic Patent References:
| JP4106952A |
Attorney, Agent or Firm:
Yoshihiro Takasaki