SEMICONDUCTOR MANUFACTURING DEVICE, ITS CLEANING METHOD AND LIGHT SOURCE UNIT

Title:

SEMICONDUCTOR MANUFACTURING DEVICE, ITS CLEANING METHOD AND LIGHT SOURCE UNIT

Document Type and Number:

Japanese Patent JP2001077011

Kind Code:

A

Abstract:

To shorten the downtime attendant on the removal of a sublimable compound, to simplify removal work and improve safety in a semiconductor manufacturing devise for applying an organic film of an anti-reflection film to the surface of a semiconductor wafer.

The top plate 34 of a hot plate 30 heating a semiconductor wafer 38 is formed of a light transmission material such as quartz. A light source unit 36 generating an ultraviolet ray which effectively dissolves organic compound is arranged above the top plate 34. In a hot plate unit 28, the semiconductor wafer 38 to which an organic material has been applied is baked. A sublimable compound contained in the organic material sticks to the lower face of the top plate 34 consequent upon a baking treatment. Whenever the hot plate unit 28 processes the prescribed number of semiconductor wafers 38, the light source unit 36 is allowed to emit light and compound adhered to the top plate 34 is irradiated with the ultraviolet ray.

Inventors:

ONO RYOJI
HATTORI SACHIKO
ODAMURA YUKO

Application Number:

JP25457199A

Publication Date:

March 23, 2001

Filing Date:

September 08, 1999

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP
RYODEN SEMICONDUCTOR SYST ENG

International Classes:

H01L21/027; F27B5/14; F27B17/00; F27D99/00; G03F7/11; G03F7/16; H01L21/00; H01L21/304; (IPC1-7): H01L21/027; G03F7/11; H01L21/304

Attorney, Agent or Firm:

Mamoru Takada (1 person outside)

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