Title:
SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP3363029
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent particles from being blown to a wafer substrate by a method wherein a convection preventing board for preventing the convection of the gas blown out of nozzles to be reflected by a wafer substrate is fitted to the gas blow-out nozzle.
SOLUTION: Four nozzles 3 are provided in an air micro, and gas 4 containing no particles blown out of each of the nozzles 3 is jetted against a wafer substrate 1. At this time, a part of the jetted gas 4 is reflected by the surface opposite to the wafer substrate 1 of a convection preventing board 6 provided on the nozzles 3 so that the reflected gas may be convected near the front ends of respective nozzles 3 to hit the wafer substrate 1 again. Through these procedures, the floating particles rolled up can be prevented from being blow to the wafer substrate 1, thereby enabling the pollution of the same 1 to be avoided even when the peripheral environment is polluted.
More Like This:
| WO/1999/063305 | ELECTRONIC SPIRIT LEVEL FOR MEASUREMENT OF INCLINATION |
Inventors:
Hirohito Inoue
Application Number:
JP12371696A
Publication Date:
January 07, 2003
Filing Date:
May 17, 1996
Export Citation:
Assignee:
Miyazaki Oki Electric Co., Ltd.
Oki Electric Industry Co., Ltd.
Oki Electric Industry Co., Ltd.
International Classes:
G01B13/00; H01L21/304; H01L21/66; (IPC1-7): H01L21/304; H01L21/66
Domestic Patent References:
| JP7214015A |
Attorney, Agent or Firm:
Kyoji Kanakura
Previous Patent: METHOD OF DISPLAYING IMAGE
Next Patent: LOW-CONCENTRATION GASEOUS ORGANIC SOLVENT TREATING DEVICE
Next Patent: LOW-CONCENTRATION GASEOUS ORGANIC SOLVENT TREATING DEVICE