Title:
半導体製造装置用部材、その製法及び成形型
Document Type and Number:
Japanese Patent JP6911140
Kind Code:
B2
Abstract:
A semiconductor manufacturing device member according to the present invention includes a ceramic disc with an internal electrode and a ceramic shaft that supports the disc. The disc and the shaft are integrated without having a bonding interface.
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Inventors:
▲のぼり▼ 和宏
Kimura Takuji
Kimura Takuji
Application Number:
JP2019550475A
Publication Date:
July 28, 2021
Filing Date:
October 31, 2018
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L21/683; B28B7/10; B28B23/00
Domestic Patent References:
| JP10242252A | ||||
| JP2010245564A | ||||
| JP2003142564A |
Attorney, Agent or Firm:
Aitec International Patent Office