Title:
半導体製造システム及び半導体製造方法
Document Type and Number:
Japanese Patent JP4319351
Kind Code:
B2
Abstract:
Variable reactances in an impedance-matching box for an RF coil, in a plasma deposition system for depositing a film of sputtered target material on a substrate, can be varied by rotating inductor cores during the deposition process so that the RF coil and substrate heating, and the film deposition, are more uniform due to "time-averaging" of the RF voltage distributions along the RF coil.
Inventors:
Stimson, Bradley, Oh.
Smith, kenneth
Gopal Raja, Prabram
Smith, kenneth
Gopal Raja, Prabram
Application Number:
JP2000541716A
Publication Date:
August 26, 2009
Filing Date:
March 25, 1999
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/203; H05H1/46; C23C14/34; H01F21/06; H01F29/10; H01J37/32; H01J37/34; H03H7/38; H03H7/40
Domestic Patent References:
| JP10060638A | ||||
| JP9143715A | ||||
| JP8264297A | ||||
| JP8070004A | ||||
| JP7018433A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Tosuke Yosuke
Yuichi Yamada
Tosuke Yosuke
Yuichi Yamada