Title:
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
Document Type and Number:
Japanese Patent JP2023170844
Kind Code:
A
Abstract:
To suppress discharge between a wiring member and a bonding wire in a semiconductor module.SOLUTION: A semiconductor module (1) includes: a semiconductor element (33) disposed on a first surface of a multilayer substrate (2); a plurality of wires (41a to 41h) electrically connecting a conductor plate (23) provided in a second region positioned in a first direction from a first region where the semiconductor element is disposed on the multilayer substrate and a second surface of the semiconductor element opposite to a first surface thereof facing the multilayer substrate; and a wiring member (53) facing the plurality of wires in a second direction, which is different from the first direction, and extending in a direction from the first surface to the second surface of the semiconductor element. As for a wire (41a), among the plurality of wires, in which a distance from a connection part with the semiconductor element when viewed in the second direction to the wiring member is the shortest, a position of an intermediate part between the connection part with the semiconductor element and a connection part with the conductor plate in the second direction is farther from the wiring member than a line segment connecting the two connection parts.SELECTED DRAWING: Figure 1
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Inventors:
TAKANO SHO
Application Number:
JP2022082908A
Publication Date:
December 01, 2023
Filing Date:
May 20, 2022
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L21/60
Attorney, Agent or Firm:
Infot Patent Attorney Corporation
Hiroyoshi Aoki
Masayuki Amada
Yoshimasa Okada
Hiroyoshi Aoki
Masayuki Amada
Yoshimasa Okada