Title:
SEMICONDUCTOR MODULE AND LEAD THEREFOR
Document Type and Number:
Japanese Patent JP3956886
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor module having excellent heat dissipation capability and excellent electromagnetic-noise shielding capability.
SOLUTION: The semiconductor module (100) comprises a semiconductor device (30) having a first electrode (31) and a second electrode (32), a wiring substrate (20) that loads the semiconductor device, a shield plate (60) that is bonded with the second electrode positioned on the opposite side of the wiring substrate, and a heat conduction member (70) that so connects the shield plate to a heat dissipating plate (10) as to keep heat conduction. The heat generated in the semiconductor device is dissipated through a route of directly flowing from the wiring substrate to the heat dissipating plate and a route of indirectly flowing to the heat dissipating plate via the shielding plate that shields the electromagnetic noise. In this way, efficient heat dissipation from the semiconductor device is taken place utilizing the electromagnetic-noise shield plate.
Inventors:
Eiji Kono
Ueyama Okura
Ueyama Okura
Application Number:
JP2003105118A
Publication Date:
August 08, 2007
Filing Date:
April 09, 2003
Export Citation:
Assignee:
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
International Classes:
H01L23/29; H01L25/07; H01L25/18; (IPC1-7): H01L23/29; H01L25/07; H01L25/18
Domestic Patent References:
| JP5259666A | ||||
| JP2002164485A |
Attorney, Agent or Firm:
Hiroshi Okawa