Title:
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
Document Type and Number:
Japanese Patent JP2010109274
Kind Code:
A
Abstract:
To provide a semiconductor module of high reliability and a method of manufacturing the semiconductor module.
A circuit element 26 of a mounted substrate 21 is covered with a first insulating resin 29, and a shield layer 22 is fixed to GND via an opening portion 31. The shield layer 22 is covered with a second insulating resin 23. The shield layer 22 can be electrically connected to a GND electrode of the mounted substrate by achieving an adhesive layer 32 and the second insulating resin with conductive paste, whereby the semiconductor module capable of being shielded attained.
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Inventors:
NAKAZATO MAYUMI
INOUE YASUNORI
MIZUHARA HIDEKI
USUI RYOSUKE
EZAKI KENICHI
NAGASAKI HIRONORI
INOUE YASUNORI
MIZUHARA HIDEKI
USUI RYOSUKE
EZAKI KENICHI
NAGASAKI HIRONORI
Application Number:
JP2008281951A
Publication Date:
May 13, 2010
Filing Date:
October 31, 2008
Export Citation:
Assignee:
SANYO ELECTRIC CO
International Classes:
H01L23/29; H01L21/56; H01L23/12; H01L23/28; H01L23/31; H01L25/04; H01L25/18
Attorney, Agent or Firm:
Hiroshi Kakutani