Title:
半導体モジュール
Document Type and Number:
Japanese Patent JP5099243
Kind Code:
B2
Abstract:
A semiconductor module is provided which is capable of lowering surges caused when switching elements are switched on and off. The module has a plurality of lead frames, switching elements, electronic components, and a sealing member. The switching elements are electrically connected to the lead frames respectively. Part of the lead frames, the switching elements, and the electronic components are sealed by the sealing member. The electronic components are mounted on primary surfaces of the lead frames respectively.
Inventors:
Yuji Hayashi
Yuichi Handa
Yuichi Handa
Application Number:
JP2011085974A
Publication Date:
December 19, 2012
Filing Date:
April 08, 2011
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| JP6085147A | ||||
| JP2188946A | ||||
| JP2001332687A | ||||
| JP2003018862A | ||||
| JP3057259A |
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office