Title:
SEMICONDUCTOR MOUNTING BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3944802
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor mounting board, equipped with a solder ball land superior in adhesion to a solder ball and a method of efficiently manufacturing the mounting board.
SOLUTION: A semiconductor mounting board is equipped with a solder ball land 11, a terminal connected to a semiconductor, and a wiring 12 which connects the solder ball land 11 to the terminal connected to the semiconductor. The solder ball land 11 thereof is provided with conductive projections 14, and grooves 15 whose depth is smaller than the height of the projections 14 are provided to the projections 14. A method of manufacturing the semiconductor mounting board is provided.
Inventors:
Naoyuki Susumu
Application Number:
JP4472098A
Publication Date:
July 18, 2007
Filing Date:
February 26, 1998
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L23/12; H05K1/11; H05K3/34; (IPC1-7): H01L23/12
Domestic Patent References:
| JP10012768A | ||||
| JP9162240A | ||||
| JP10032280A | ||||
| JP8222573A | ||||
| JP5206599A | ||||
| JP8181432A | ||||
| JP8293510A | ||||
| JP10022612A | ||||
| JP5291714A |
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