Title:
SEMICONDUCTOR PACKAGE FOR ELECTRIC POWER
Document Type and Number:
Japanese Patent JPH0358460
Kind Code:
A
Abstract:
PURPOSE: To maximize heat efficiency while minimizing the space by fixing a heat sink to the surface at the end part of the back face body of a semiconductor device through a securing unit extending through corresponding holes made through the heat sink and the back face body. CONSTITUTION: The power semiconductor package comprises a semiconductor chip 20 encased in a case 11 having two opposite major surfaces 16, 18 and end part surfaces 12, 14, a plurality of pins 22 extending from one end surface of the case 11 while being connected with the chip 20, and a thermally conductive back face body 24 having two opposite major surfaces 30, 32 and two opposite end part surfaces 26, 28 where the case 11 is fixed to one major surface 18 such that the end part surface 12 of the case 11 will be flush with the end part surfaces 26 of the back face body 24. Each end part surface 26, 18 of the back face body 24 is provided with one or more fixing hole 34 for receiving an external fastener. The pin 22 can be connected with a printed wiring board 38 fixed contiguously to one end part surface 26 of the back face body 24 and a heat sink 44 can be connected directly with the other end part surface of the back face body. This structure can eliminate the need for an auxiliary heat sink and enhance energy efficiency.
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Inventors:
AARU EMU ESUTESU JIYUNIA
Application Number:
JP18818390A
Publication Date:
March 13, 1991
Filing Date:
July 18, 1990
Export Citation:
Assignee:
HUGHES AIRCRAFT CO
International Classes:
H01L23/40; H01L23/36; (IPC1-7): H01L23/36; H01L23/40
Attorney, Agent or Firm:
Takehiko Suzue (3 outside)
Next Patent: SEMICONDUCTOR ELEMENT CASE