SEMICONDUCTOR PACKAGE TERMINAL POLISHING DEVICE

Title:

SEMICONDUCTOR PACKAGE TERMINAL POLISHING DEVICE

Document Type and Number:

Japanese Patent JPH05154757

Kind Code:

A

Abstract:

PURPOSE: To efficiently polish the terminals of a semiconductor package such as PLCC.

CONSTITUTION: A polishing cylinder 10, a polishing sheet 14 provided on the inner wall of the polishing cylinder 10, a lower pedestal 16 supporting a semiconductor package group 12 from below, a spring 18 invariably pushing up the lower pedestal 16, an upper pressing plate 20 pressing the semiconductor package group 12 from above, and a sliding lever 22 connected to the upper pressing plate 20 and vertically sliding the upper pressing plate 20 in the polishing cylinder 10 are provided. When the sliding lever 22 is vertically reciprocated, the semiconductor package group 12 is vertically slid in the polishing cylinder 10, and the polishing sheet 14 polishes the terminal group of the semiconductor package group 12. Terminals can be efficiently polished.

Inventors:

KOIZUMI TADAO

Application Number:

JP31927491A

Publication Date:

June 22, 1993

Filing Date:

December 03, 1991

Export Citation:

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Assignee:

KAWASAKI STEEL CO

International Classes:

B24B29/02; H01L23/50; (IPC1-7): B24B29/02; H01L23/50

Attorney, Agent or Firm:

Toshihiko Kanayama (2 outside)

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