Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JPH0368156
Kind Code:
A
Abstract:
PURPOSE: To prevent a semiconductor chip from deteriorating in high frequency characteristics and yield by a method wherein a metal member of good conductivity composed of a wire joint and an outer lead formed into an integral structure is fixed to a ceramic cutout section.
CONSTITUTION: Only the semiconductor chip mounting section 13 of a ceramic 12 is metallized, and a wire joint is hollowed out into a recess. Metal pieces 14-17 of good conductivity composed of wire joints and outer leads which are formed into integral structures respectively are bonded to the recesses of the ceramic 12 with silver solder or the like.
Inventors:
USUKI TOSHIO
Application Number:
JP20311289A
Publication Date:
March 25, 1991
Filing Date:
August 05, 1989
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/12; H01L21/338; H01L29/812; (IPC1-7): H01L21/338; H01L23/12; H01L29/812
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)
Next Patent: JPH0368157