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Patent Searching and Data


Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JPH04107962
Kind Code:
A
Abstract:

PURPOSE: To perform mounting without extending lead wires to a cooler head while performing electric test by a socket by branching one signal wire into the leads for electric test having large lead intervals and the leads for mounting having small lead intervals.

CONSTITUTION: A package main body 1 is provided with two kinds of mutually corresponding leads such as the leads 2a for mounting and the leads 2 for electric test for being mounted on a cooler head 4. The leads 2 for electric test and the leads 2a for mounting correspond one-to-one, and the corresponding leads are relatively connected in the inside of the main body 1. And, the leads 2a for mounting are used for mounting while the leads 2 for electric test are connected through sockets for being given electric test.


Inventors:
IWADE SHUHEI
Application Number:
JP22520290A
Publication Date:
April 09, 1992
Filing Date:
August 29, 1990
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
Mitsuteru Soga (5 people outside)