To provide a semiconductor package capable of manufacturing semiconductor devices which can be mounted on a printed-wiring board at high density.

A first electronic component 40 is mounted on a conductor circuit 21 on one face. Then, an unsealed part 11 which is connected electrically to the conductor circuit 21 on one face, on which a second electronic component 60 is to be mounted and from which a plurality of conductor circuits 22 are exposed is formed on a substrate 10 on the other face, and the conductor circuit 20 on one face and the first electronic component 40 are sealed. As a result, when an electronic component which fulfills a function by being combined with the second electronic component 60 such as a semiconductor device or the like to be mounted on the conductor circuit 22 exposed in the unsealed part 11 is mounted as the first electronic component 40, it is not required to arrange the electronic components around semiconductor device which are manufactured by using a semiconductor package, and the semiconductor devices can be mounted at high density.