Title:
SEMICONDUCTOR PACKAGING STRUCTURE
Document Type and Number:
Japanese Patent JP2994555
Kind Code:
B2
Abstract:
PURPOSE: To increase the packaging density in the case of the bare chip packaging step.
CONSTITUTION: The title semiconductor packaging structure is composed of the first bare chip 2a packaged on a printed substrate 1 by a bump 4, the first reinforcement bonding agent 7 bonding the first bare chip 2a, a die paste 6 applied on the back surface of the first bare chip 2a, the second bare chip 2b packaged on the back surface of the first bare chip 2a coated with the die paste 6, a wire 5 junctioning the second bare chip 2b with this printed substrate 1 as well as the second reinforcement bonding agent 8 bonding the second chip 2b.
Inventors:
Yasunori Sasaki
Fujii Masanao
Fujii Masanao
Application Number:
JP12098594A
Publication Date:
December 27, 1999
Filing Date:
June 02, 1994
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L25/18; H01L25/065; H01L25/07; (IPC1-7): H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP428260A | ||||
| JP6048254U |
Attorney, Agent or Firm:
Masao Yamakawa
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