Title:
SEMICONDUCTOR PLASTIC PACKAGE
Document Type and Number:
Japanese Patent JPS6074457
Kind Code:
A
Abstract:
PURPOSE: To prevent the generation of cracks by a method wherein the semiconductor pellet connected to a lead frame is sealed by the resin having a satin surface, thereby enabling to reduce mold-releasing force.
CONSTITUTION: The whole surface of the cavity 8b, consisting of a top force 1b and a bottom force 2b which will be used to resin-seal a semiconductor plastic package, consists of a smoothly-formed uneven satin surface. The semiconductor pellet 10, which is mounted on a lead frame 9 and connected to the lead frame 9 by a gold wire 11, is arranged in the cavity 8b, fused resin is filled in the cavity 8b and hardened there.
Inventors:
KANEDA AIZOU
TSUNODA SHIGEHARU
OOTSUKI KEIZOU
NAKAGAWA TAKASHI
AOKI MASAYOSHI
TSUNODA SHIGEHARU
OOTSUKI KEIZOU
NAKAGAWA TAKASHI
AOKI MASAYOSHI
Application Number:
JP6335884A
Publication Date:
April 26, 1985
Filing Date:
April 02, 1984
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/28; B29C45/14; B29C45/37; H01L21/56; (IPC1-7): H01L23/28
Domestic Patent References:
| JP52087998Y | ||||
| JP51176385Y | ||||
| JP49126249Y | ||||
| JPS5414661U | 1979-01-30 | |||
| JPS50103791A | 1975-08-16 | |||
| JPS5077464U | 1975-07-05 | |||
| JPS5163866A | 1976-06-02 | |||
| JPS5270165U | 1977-05-25 | |||
| JPS5110701U | 1976-01-26 |
Attorney, Agent or Firm:
Katsuo Ogawa