Title:
半導体パワーモジュール
Document Type and Number:
Japanese Patent JP7053461
Kind Code:
B2
Abstract:
A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at an other surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.
Inventors:
Kenji Hayashi
Linkou Tadashi
Linkou Tadashi
Application Number:
JP2018520961A
Publication Date:
April 12, 2022
Filing Date:
May 31, 2017
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| JP9102578A | ||||
| JP6021323A | ||||
| JP2014011338A | ||||
| JP2013125848A | ||||
| JP2011176087A |
Foreign References:
| WO2014034411A1 | ||||
| US20130075932 |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office