SEMICONDUCTOR PROCESSING APPARATUS

Japanese Patent JP2005051269

A

To improve the availability and the reliability of a processing apparatus by monitoring the state of processing and by detecting an abnormal processing or predicting a processing result based on the monitor output.

The semiconductor processing apparatus includes: a sensor 3 for monitoring the state of processing of the semiconductor processing apparatus which processes a semiconductor wafer; a processing result input means 5 for inputting the measured value of the processing result of the semiconductor wafer processed by the semiconductor processing apparatus; a model formula generation section 7 for generating a model formula for predicting a processing result using the sensor data as explanation variables based on the sensor data obtained by the sensor and the measured value; a processing result prediction section 9 for predicting a processing result based on the model formula and the sensor data; and a processing condition control section 10 for controlling the processing condition of the semiconductor processing apparatus so as to correct the difference between the predicted processing result and the predetermined set value by comparing them.

WO2000029640	METHOD FOR RESIDUE-FREE ANISOTROPIC ETCHING OF ALUMINUM AND ITS ALLOYS
JPS6474727	DRY ETCHING METHOD
JP2000164865	MANUFACTURE OF SEMICONDUCTOR DEVICE

TANAKA JUNICHI
KITSUNAI HIROYUKI
KAGOSHIMA AKIRA
SHIRAISHI DAISUKE
YAMAMOTO HIDEYUKI
IKUHARA SHIYOUJI
MASUDA TOSHIO

JP2004297773A

February 24, 2005

October 12, 2004

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HITACHI LTD
HITACHI IND CO LTD

H01L21/3065; H01L21/02; H01L21/205; (IPC1-7): H01L21/02; H01L21/205; H01L21/3065

JPH10125660A

1998-05-15

Ichiro Suzuki
Kenjiro Take

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