Title:
SEMICONDUCTOR PROCESSING SHEET
Document Type and Number:
Japanese Patent JP2019079961
Kind Code:
A
Abstract:
To provide a semiconductor processing sheet, which can prevent occurrence of air entrapment between a resin film forming layer and a release film when stored at a low temperature.SOLUTION: A semiconductor processing sheet 101 includes: a resin film forming layer 12 provided on a support sheet 11 having a base material; and a jig fixing tape 14 provided on the resin film forming layer 12. A release film 15 is provided on the resin film forming layer 12 and the jig fixing tape 14, a thickness of the jig fixing tape 14 is not less than 25 μm and not more than 65 μm.SELECTED DRAWING: Figure 1
Inventors:
TSUCHIYAMA SAYAKA
SATO AKINORI
YAMAGISHI MASANORI
SATO AKINORI
YAMAGISHI MASANORI
Application Number:
JP2017206518A
Publication Date:
May 23, 2019
Filing Date:
October 25, 2017
Export Citation:
Assignee:
LINTEC CORP
International Classes:
H01L21/301; C09J7/20; C09J201/00
Domestic Patent References:
| JP2015070059A | 2015-04-13 | |||
| JP2008066336A | 2008-03-21 |
Foreign References:
| WO2015178346A1 | 2015-11-26 |
Attorney, Agent or Firm:
Nishizawa Kazumi
Mitsunaga Igarashi
Hiroyuki Kato
Mitsunaga Igarashi
Hiroyuki Kato