Title:
SEMICONDUCTOR PROCESSING TAPE
Document Type and Number:
Japanese Patent JP2019176157
Kind Code:
A
Abstract:
To provide a semiconductor processing tape which can be sufficiently heated and shrunk in a short time and can maintain a kerf width.SOLUTION: A semiconductor processing tape 10 according to the present invention includes an adhesive tape 15 including a base film 11 and an adhesive layer 12 formed on at least one side of the base film 11, and in the adhesive tape 15, the sum of the total value of the differential values of thermal deformation rates at every 1°C between 40°C and 80°C measured at the temperature rise with a thermomechanical property tester in the MD direction and the total value of the differential values of thermal deformation rates at every 1°C between 40°C and 80°C measured at the temperature rise with the thermomechanical property tester in the TD direction is a negative value.SELECTED DRAWING: Figure 1
Inventors:
SANO TORU
SENDAI AKIRA
HASHIMOTO KOSUKE
SENDAI AKIRA
HASHIMOTO KOSUKE
Application Number:
JP2019081609A
Publication Date:
October 10, 2019
Filing Date:
April 23, 2019
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
H01L21/301; C09J7/30; C09J7/38; C09J201/00
Domestic Patent References:
| JP2012174945A | 2012-09-10 | |||
| JP2015211081A | 2015-11-24 | |||
| JP2015151453A | 2015-08-24 |
Foreign References:
| WO2013172328A1 | 2013-11-21 |
Attorney, Agent or Firm:
Ryo Matsushita
Hashimoto Takako
Hashimoto Takako