Title:
半導体加工用テープ
Document Type and Number:
Japanese Patent JP7129375
Kind Code:
B2
Abstract:
The present invention provides a tape for semiconductor processing which can be sufficiently heated and contracted for a short period of time and can maintain a kerf width. This tape 10 for semiconductor processing of the present invention has an adhesive tape 15 having: a base film 11; and an adhesive layer 12 formed on at least one surface side of the base film 11, and the adhesive tape 15 is characterized in that the total sum of an average value of differential values of thermal deformation rates per 1°C in an MD direction which are measured by a thermomechanical property tester when the temperature rises between 40°C and 80°C, and an average value of differential values of thermal deformation rates per 1°C in a TD direction which are measured by the thermomechanical property tester when the temperature rises between 40°C and 80°C is a minus value.
Inventors:
Toru Sano
Akira Sendai
Kousuke Hashimoto
Akira Sendai
Kousuke Hashimoto
Application Number:
JP2019081611A
Publication Date:
September 01, 2022
Filing Date:
April 23, 2019
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301; C09J7/30; C09J7/38; C09J201/00
Domestic Patent References:
| JP2012174945A | ||||
| JP2014157964A | ||||
| JP2004119992A | ||||
| JP63205924A | ||||
| JP2011216508A |
Attorney, Agent or Firm:
Ryo Matsushita
Takako Hashimoto
Takako Hashimoto
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