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Title:
SEMICONDUCTOR RESIN MOLDING EQUIPMENT
Document Type and Number:
Japanese Patent JPH08181159
Kind Code:
A
Abstract:

PURPOSE: To surely bend and pick out a gate from a base end part, by installing a pair of first rollers which upward incline a gate sticking to a package together with a lead frame, and a pair of second rollers which downward incline the gate, on the carrying-out side of a mold.

CONSTITUTION: A pair of first rollers 19 which clamp a lead frame l and upward incline a gate 5 sticking to a package 2 together with a lead frame 1, and a pair of second rollers 14 which downward incline the gate 5 are installed on the carrying-out side of a mold. When the lead frame l is carried, it is upward inclined 10-20° from the horizontal direction together with the gate 5, as the result of cooperation of both pressing parts l7b of a bending roller 17 and both abuttting parts 18b of a retaining roller 18, so that cracks are generated in the base end part of the gate 5 connected with a package 2. Next the gate 5 is downward inclined 20-25° from the horizontal direction with both gate break parts 13b of a gate break roller 13. Thereby the gate 5 is bent and picked out from the base end part where the cracks are generated.


Inventors:
SAWADA HIROYUKI
TAKEGAWA YUJI
Application Number:
JP31820494A
Publication Date:
July 12, 1996
Filing Date:
December 21, 1994
Export Citation:
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Assignee:
TOSHIBA F A SYSTEM ENG
TOSHIBA CORP
International Classes:
H01L21/56; B29C45/38; (IPC1-7): H01L21/56
Attorney, Agent or Firm:
Tsuyoshi Sato



 
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